Chip scale is one of the most popular types of integrated circuits. Quad flat No Leads (QFN) is a one-of-a-kind chip scale package with lead frame substrate. The quad-slot is the same as the encapsulated package is a surface mount technology where IC’s are attached to the surfaces of printed circuit boards. Quad flat no-leads electrically connected to the integrated circuits to printed circuit boards (PCB). The QFN are available in configurations as well as saw singulated and punch formats. High performance (thermal and electrical), compacted size and lower costs are some of the most important differentiating features. QFN is widely used in RF applications, Bluetooth In 2015, US $ 58.5 Bn, and it is expected to grow due to high demand. Thus, boosting global quad-flat no-leads.
The QFN market is driven by the high demand in printed circuit boards and flexible printed circuit boards. Availability of QFN with various sizes boosts the global QFN market. Besides, the trend of smaller circuit designs in the electronic industry, increase in smartphone production and other handheld devices fuel the global QFN market. QFN market is a large surface mount area, lower cost, light weight.
(JEDA), Joint Electron Device Engineering Council (JEDEC), and others are the world’s leading QFN manufacturing companies.
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The global quad-face no-leads market is segmented on the basis of QFN and application.
Based on type of QFN, global quad-flat no-lead market is segmented into:
- Thin quad flat no-lead package (TQFN)
- Dual flat no-lead package (DFN)
Based on application, global quad-flat no-lead market is segmented into:
- RF
- Power management
- Multi-chip modules
- Wearable’s
- Internet of Things (loT)
- Bluetooth devices
- automotive
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(APA) and the Middle East & Africa (MEA). North America holds the major share in the quad flat No-leads market due to increasing sales of flexible circuits. Followed by North America is Asia Pacific, especially China, has a maximum share of Quad Flat No-Lead Market. The quadflat no-leads marketin Europe, Latin America, and MEA are comparatively less robust than APAC market since the presence of the majority of electronic manufacturing sites in Asian countries.
QuadFlat No-leads Packaging Market – Major Players:
Lumileds Holding BV, ASE Group, Henkel Corporation, Broadcom Limited, China Wafer Level CSP Co., Ltd., etc.
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